Hybrid HP 095 Pick & Place


 

hybrid HP 095

hybrid HP 095


 
Pick & Place by Hybrid HP 095, in good condition.
 
Hybrid HP 095 product information.
 
Dimensions Hybrid
Base l.w.h.off-line = 1700 x 1500 x 2200 mm
in-line = 1200 x 1500 x 2200 mm
Board thickness-size
min. 0.5mm – max. 4.5 mm thick
min. 30 x 30mm – off-line max. 330 x 450 mm
in-line max 300 x 450 mm
Maximum Warpage
0.5 mm up – 1 mm down
Component Height
Top max. 14 mm – bottom max. 30 mm
Placement Accuracy
±50 µm with vision and ±100 µm (chips)
min. pitch 0.4 mm
Placement Rate
Up to 4,200 cph IPC rated
Components
Chip, Melf, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, LCC
etc. smallest pitch 0.4 mm
Component Size
0402 up to 42 x 42 mm with (prepared for 0201)
Motion
X and Y, AC / DC servo motors with Linear encoder and digital
motion controller
Control
Integrated microprocessor controller with can interface
combined with PC running on Windows XP®
Interface
Fully SMEMA compatible,
Conveyor height 865 to 970 mm
Feeder Characteristics
Intelligent feeders, in-line 88 / off-line 132 – 8 or 12 mm tapes,
132 / 198 – plastic sticks, number of trays depending on pcb
size, tape feeders from 8 to 44 mm, plastic stick up to 50 mm
wide, tray 335 x 185 mm
Vision System
ESI Correctplace®, Automatic board alignment – full vision
component alignment and analysis by vision system. Test on
lead pitch, sqew angle, BGA bal size and Nr of balls
Cameras
Fiducial and component align Camera with CCD chip
Power-Air Requirement
220 Vac / 50 – 60Hz / 2500 Watt
6 Bar / 85 PSI / 80 L-min
Operating Temperature
18 – 30 degree Celsius
Noise Level
Noise emission during operation < 70 dB(A), Weight 450kg without feeders 800kg with feeders   For further inquiries click here
Or send an email to: Info@fixtrade.nl