BGA Rework: Dinghua DH-G200 BGA rework station
Recently Acquired Dinghua DH-G200 BGA Rework station in excellent condition.
vintage 2016
Friendly Design:
Embedded industrial PC With intelligent temperature module, Stable and reliable.
Windows Operating system in English
5 different sizes of nozzles – Upper: 31x31MM, 41x41mm Bottom: 34x34mm 55x55mm
3 heating zones, two of which are Hot air and the 3rd is an Infrared pre-heat zone
High power cross flow fan providing ample cooling and helps preventing warpage.
Accurate temperature control:
Three independent temperature controllable heating zones + PID self setting adjusted, Temperature accuracy will be ±2°C
8 heating segments and massive storage of groups
Convenient BGA heating curve settings and searchable index
Automatic temperature curve analysis.
Convenient visual alignment:
Optical alignment + CCD color lens system
2 color separation, magnification, micro adjustment
Auto focus, auto correction, auto color differentiation.
Light level adjustment system.
Japan camera can move front and back.
Built-in vacuum pump, for picking up BGA components.
Precision components:
Precise fine-tuning of BGA chip
X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 MM.
V-groove clamp + universal fixture suitable for all kinds of PCB.
Hot air nozzle with magnet, rotate in any angle, easy replace and operate.
Heating system and mount head 2 in 1 design, precise positioning.
Safe and secure:
With fan failure protection, thermocouple failure protection function.
Overheating protection, emergency stop function.
Start up password and modify protection.
Dinghua DH-G200 Rework station Specifications
Voltage | AC 230V (110v optional) |
Total power | 5300W |
Top heater | 1200W |
lower heater | 1200W |
Bottom heater | 2700W |
Positioning | V-groove, PCB support |
Temperature control | K Sensor, Closed loop |
Temp accuracy | ±2 degree |
Workbench fine-tuning | ±15mm forward/backward ±15mm right/left |
Placement accuracy | ±0.01mm |
Camera magnification | 10x-220x |
PCB size | Min 20x20mm Max 390x400mm |
BGA chip size | 2x2 ~ 80x80mm |
Minimum chip spacing | 0.15mm |
Dimensions | 610x570x750mm |
Weight | Approx 60KG |