BGA Rework: Dinghua DH-A2 Rework station

Recently acquired Dinghua DH-A2 Rework station in excellent condition
Vintage 2020

Friendly Design:
Embedded industrial PC With intelligent temperature module and stepper motor driver, Stable and reliable.
Windows Operating system in english
5 different sizes of nozzles – Upper: 31x31MM, 41x41mm Bottom: 34x34mm 55x55mm
3 heating zones, two of which are Hot air and the 3rd is an Infrared pre-heat zone
High power cross flow fan providing ample cooling and helps preventing warpage.

Accurate temperature control:
Three independent temperature controllable heating zones + PID self setting adjusted, Temperature accuracy will be ±2°C
8 heating segments and massive storage of groups
Convenient BGA heating curve settings and searchable index
Automatic temperature curve analysis.

Convenient visual alignment:
Optical alignment + CCD color lens system
2 color separation, magnification, micro adjustment
Auto focus, auto correction, auto color differentiation.
Light level adjustment system.
Japan camera can move front and back.
Built-in vacuum pump, for picking up BGA components.

Precision components:
Precise fine-tuning of BGA chip
X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 MM.
V-groove clamp + universal fixture suitable for all kinds of PCB.
Hot air nozzle with magnet, rotate in any angle, easy replace and operate.
Heating system and mount head 2 in 1 design, precise positioning.

Safe and secure:
With fan failure protection, thermocouple failure protection function.
Overheating protection, emergency stop function.
Start up password and modification protection.

Dinghua DH-A2 Rework station specifications

Voltage 230V AC (110v optional)
Total power 5400W
Top heater 1200W
lower heater 1200W
Bottom heater 2700W
Positioning V-groove, PCB support
temperature control K Sensor, Closed loop
Temp. Accuracy ±1 degree
workbench fine-tuning ±15mm forward/backward ±15mm right/left
Placement accuracy ±0.01mm
camera magnification 10x-220x
PCB size Min 20x20mm Max 370x410mm
BGA chip size 2x2 ~ 80x80mm
Minimum chip spacing 0.15mm
Dimensions 690x670x870mm
Net Weight Approx 70KG

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