AOI inspection:Valtronic VT-S730 3D aoi system
Recently acquired Valtronic VT-S730 3D Aoi system
Vintage: 2015
Description:
VT-S730 series Post Reflow inspection machines have been widely adopted in production lines where the highest quality control is required, such as the Automotive Industry. VT-S730 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called “color highlight ™ 3D shape reconstruction technology” providing the exceptional accuracy in Solder Joint Inspection.
Features
• Top View 4Mpixel/12Mpixel Camera with Telecentric Lens.
• 4x Oblique-Angle Inspection Cameras
• Latest 3D Programmable DLP Projectors (25mm max Height Inspection).
• Omron’s Unique Color-Highlight Illumination Technology.
• Real 3D Image Technology for Component and High-Quality Solder Joint Inspection.
• Real-time Interactive 3D data feedback to the Programmer.
• View and edit samples of all parts on the board simultaneously (in real-time) without interrupting Production.
• Process histograms are created automatically for all inspection tests and components
• AI self-optimization tools can perform automated inspection logic and criteria changes.
• Real defect images can be stored in a Central library and used to improve the tuning process.
• Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution.
• Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
• Omron Q-upNavi: Combine SPI, AOI and AXI Inspection Result Data for True Root-Cause Process Analysis for Process Improvement.
• Omron Q-upAuto: Advanced Manufacturing Analysis Combining Q-upNavi ‘Inspection Result Data’, with ‘Manufacturing Process Data’ for High Level Process Improvement.
VT-730 is the latest 3D-AOI technology on the market, providing the Highest-Quality Solution for tomorrows production environments.
VT-S730 Specifications
| Model | S730 | |
| Dimensions | 1100 (W) × 1470 (D) × 1500 (H) mm | |
| Weight | Approx. 800 kg | |
| Power supply | Voltage | 200 - 240 VAC (single phase), voltage fluctuation range ±10% |
| Normal rated power | 2.8 kVA | |
| Line height | 900 ±20 mm | |
| Air supply pressure | 0.3 - 0.6 MPa | |
| Operating temperature range | 10 - 35°C | |
| Operating humidity range | 35 - 80%RH (Non-condensing) | |
| Image signal | Imaging system | 4M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 15 μm | |
| FOV | 30.00 × 30.72 mm | |
| Supported PCB size | 50 (W) × 50 (D) - 510 (W) × 460 (D) mm | |
| Thickness | 0.4 - 4 mm | |
| Clearance | Above: 40 mm; Below: 40 mm | |
| Height measurement range | 25 mm | |
| Inspection item | Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge | |
