Recently acquired Valtronic VT-S730 3D Aoi system
VT-S730 series Post Reflow inspection machines have been widely adopted in production lines where the highest quality control is required, such as the Automotive Industry. VT-S730 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called “color highlight ™ 3D shape reconstruction technology” providing the exceptional accuracy in Solder Joint Inspection.
• Top View 4Mpixel/12Mpixel Camera with Telecentric Lens.
• 4x Oblique-Angle Inspection Cameras
• Latest 3D Programmable DLP Projectors (25mm max Height Inspection).
• Omron’s Unique Color-Highlight Illumination Technology.
• Real 3D Image Technology for Component and High-Quality Solder Joint Inspection.
• Real-time Interactive 3D data feedback to the Programmer.
• View and edit samples of all parts on the board simultaneously (in real-time) without interrupting Production.
• Process histograms are created automatically for all inspection tests and components
• AI self-optimization tools can perform automated inspection logic and criteria changes.
• Real defect images can be stored in a Central library and used to improve the tuning process.
• Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution.
• Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
• Omron Q-upNavi: Combine SPI, AOI and AXI Inspection Result Data for True Root-Cause Process Analysis for Process Improvement.
• Omron Q-upAuto: Advanced Manufacturing Analysis Combining Q-upNavi ‘Inspection Result Data’, with ‘Manufacturing Process Data’ for High Level Process Improvement.
VT-730 is the latest 3D-AOI technology on the market, providing the Highest-Quality Solution for tomorrows production environments.
|Dimensions||1100 (W) × 1470 (D) × 1500 (H) mm|
|Weight||Approx. 800 kg|
|Power supply||Voltage||200 - 240 VAC (single phase), voltage fluctuation range ±10%|
|Normal rated power||2.8 kVA|
|Line height||900 ±20 mm|
|Air supply pressure||0.3 - 0.6 MPa|
|Operating temperature range||10 - 35°C|
|Operating humidity range||35 - 80%RH (Non-condensing)|
|Image signal||Imaging system||4M pixel camera|
|Inspection principle||3D reconstruction through color highlight and phase shift technology|
|Image resolution||15 μm|
|FOV||30.00 × 30.72 mm|
|Supported PCB size||50 (W) × 50 (D) - 510 (W) × 460 (D) mm|
|Thickness||0.4 - 4 mm|
|Clearance||Above: 40 mm; Below: 40 mm|
|Height measurement range||25 mm|
|Inspection item||Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge|